Special substrates

Besides standard wafers and blanks we produce special substrates based on customer\’s requests. Below are a few examples of these substrates. In case of other requirements, feel free to contact us.

1) Rectangular blanks / wafers

Parameter, orientation Value
Material quartz, Q > 1.8 mil.
Cutting angle 43.75° (± 10\’)
Dimensions 50.80 x 12.80 (± 0.13) [mm]
Thickness 965 (± 76) [μm]
Front side polished SAW, RMS < 0.5 μm
Back side fine lapped, Ra ~ 0.2 μm

2) Rings

Parameter, orientation Value
Material quartz, Q > 1.8 mil.
Cutting angle X90° (± 1°)
Dimensions
( do / di / thickness )

1) 15.24 / 7.75 / 0.76 mm
2) 20.0 / 11.9 / 1.2 mm
3) 26.6 / 14.3 / 0.8 mm
4) 32.6 / 18.3 / 1.2 mm

Front side lapped, Ra ~ 1 μm
Back side lapped, Ra ~ 1 μm

3) Rectangular blanks

Parameter, orientation Value
Material quartz, Q > 1.8 mil.
Cutting angle ZX 0° + 1°50\’ (± 15\’)
Dimensions 38.10 x 38.10 (± 0.05) [mm]
Thickness 400 (± 3) [μm]
Front side fine lapped, Ra ~ 0.2 μm
Back side fine lapped, Ra ~ 0.2 μm

Note:
All of the above parameters are only sample specifications.
Differences from standard values and other parameters can be consulted.